this is information on a product in full production. january 2014 docid025629 rev 1 1/8 8 BAL-CC1101-01D3 50 ohm nominal input / conjugate match balun to cc1101 / cc1150 (868-928 mhz), with integrated harmonic filter datasheet ? production data features ? 50 ? nominal input / conjugate match to cc1101 / cc1150 ? low insertion loss ? low amplitude imbalance ? low phase imbalance ? coated flip-chip on glass ? small footprint: < 2.1 mm2 benefits ? extremely low profile (< 550 m after reflow) ? high rf performance ? rf bom and area reduction description stmicroelectronics BAL-CC1101-01D3 is an ultra miniature balun which integrates a matching network in a monolithic glass substrate. this has been customized for the cc1101 / cc1150 ti transceiver. it?s a design using stmicroelectronics ipd (integrated passive device) technology on non- conductive glass substrate to optimize rf performance. figure 1. application schematic flip-chip package 4 bumps z BAL-CC1101-01D3 cc1101 cc1150 harmonic filter www.st.com
characteristics BAL-CC1101-01D3 2/8 docid025629 rev 1 1 characteristics table 1. a bsolute maximum rating (limiting values) symbol parameter value unit min. typ. max. p in input power rf in 20 dbm v esd esd ratings human body model (jesd22-a114c), all i/o one at a time while others connected to gnd 2000 v esd ratings machine model, all i/o 500 esd ratings charged device model (jesd22-c101d) 500 t op operating temperature -40 +125 oc table 2. electrical characteristics - rf performance (t amb = 25 c) symbol parameter value unit min. typ. max. z out nominal differential output impedance conjugate match to cc1101 / cc1150 ? z in nominal input impedance 50 f frequency range (bandwidth) 779 928 mhz i l insertion loss in bandwidth 1.7 1.9 db r l_se single ended return loss in bandwidth 15 db r l_diff differential ended return loss in bandwidth 15 db imb phase imbalance -10 10 a imb amplitude imbalance -1 1 db att harmonic levels (tx filter) attenuation at 2fo attenuation at 3fo -25 -50 db
docid025629 rev 1 3/8 BAL-CC1101-01D3 characteristics 1.1 measurements figure 2. transmission (s21) figure 3. insertion loss in band 0.0 -20 -40 -60 -80 s21 (db) 0.5 1.0 1.5 2.5 2.0 f (ghz) 3.5 3.0 4.0 780 840 900 930 800 820 860 880 920 0.0 -0.5 -1.0 -1.5 -2.0 -2.5 -3.0 f (mhz) i (db) l figure 4. return loss single-ended figure 5. return loss differential 0 -10 -20 -30 -40 r l-se (db) 780 900 930 800 820 880 920 840 860 f (mhz) 0 -5 -10 -15 -20 -25 -30 r l-diff (db) 780 840 900 930 800 820 860 880 920 f (mhz) figure 6. phase imbalance figure 7. amplitude imbalance 10 8 6 4 2 0 780 840 900 930 800 820 860 880 920 imb (db) f (mhz) 780 840 900 930 800 820 860 880 920 1.0 0.8 0.6 0.4 0.2 0.0 -0.2 -0.4 -0.6 -0.8 -1.0 f (mhz) a imb (db)
characteristics BAL-CC1101-01D3 4/8 docid025629 rev 1 figure 8. h2 attenuation figure 9. h3 attenuation 0.0 -20 -40 -60 -80 2f0 (db) 1.558 1.608 1.658 1.708 f (ghz) 1.808 1.758 1.858 3f0 (db) 2.337 2.537 2.437 2.637 2.737 2.387 2.587 2.487 2.687 2.784 f (ghz) 0.0 -20 -40 -60 -80
docid025629 rev 1 5/8 BAL-CC1101-01D3 package information 2 package information ? epoxy meets ul94, v0 ? lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. package dimensions (bump side view) figure 11. pcb view cc1101 with BAL-CC1101-01D3 orientation marking 255 m 40 6 m 30 60 1200 m 225 m 325 m 500 m 1050 m 50 595 m se gnd 2020 50 m 225 m diff se diff gnd top 220 m diameter smt 320 m diameter 1400 m
package information BAL-CC1101-01D3 6/8 docid025629 rev 1 figure 12. marking figure 13. flip chip tape and reel specifications note: more information is available in the stmicroelectronics application note: an2348 flip-chip: ?package description and recommendations for use? x y x w z w dot, st logo ecopack grade xx = marking z = manufacturing location yww = datecode (y = year ww = week) , dot identifying pin a1 location user direction of unreeling all dimensions are typical values in mm 4.0 4.0 2.0 8.0 1.75 3.5 ? 1.55 0.71 1.14 0.20 2.19
docid025629 rev 1 7/8 BAL-CC1101-01D3 ordering information 3 ordering information 4 revision history table 3. ordering information order code marking package weight base qty delivery mode BAL-CC1101-01D3 ss flip chip 2.21 mg 5000 tape and reel (7?) table 4. document revision history date revision changes 23-jan-2014 1 initial release
BAL-CC1101-01D3 8/8 docid025629 rev 1 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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